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BSS138WH6433XTMA1 - Infineon

Description: Infineon BSS138WH6433XTMA1 N-channel MOSFET Transistor, 0.28 A, 60 V, 3-Pin SOT-323

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Symbol
BSS138WH6433XTMA1 - Infineon - PCB symbol
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PCB Footprints
BSS138WH6433XTMA1 - Infineon PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT323-ren1
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3D Models
BSS138WH6433XTMA1 - Infineon - 3D model - SOT23 (3-Pin) - SOT323-ren1
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BSS138WH6433XTMA1 Details

  • Manufacturer Part Number:

    BSS138WH6433XTMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-323, 3 PIN

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.95

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.28 A

  • Drain-source On Resistance-Max:

    3.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    4.2 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    0.5 W

  • Power Dissipation-Max (Abs):

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSS138WH6433XTMA1 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the BSS138WH6433XTMA1 is a 3-pin SOT23 package with a pitch of 0.95 mm and a pad size of 1.3 mm x 1.3 mm.
  • The BSS138WH6433XTMA1 has a thermal pad on the bottom of the package, which should be connected to a thermal pad on the PCB to improve heat dissipation. A thermal via array or a copper pour can be used to dissipate heat efficiently.
  • The BSS138WH6433XTMA1 is a high-speed switch with a maximum operating frequency of 100 MHz. However, the actual operating frequency may be limited by the application's requirements and the PCB layout.
  • To ensure reliability in high-temperature applications, it is recommended to follow the recommended operating conditions, use a suitable thermal management system, and consider using a thermally conductive material such as a thermal interface material (TIM) between the device and the heat sink.
  • The BSS138WH6433XTMA1 is rated for a maximum voltage of 12 V. While it can be used in high-voltage applications, it is essential to ensure that the device is operated within its recommended operating conditions to prevent damage or premature failure.

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BSS138WH6433XTMA1 Overview

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