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BSS223PWH6327XTSA1 - Infineon

Description: Infineon BSS223PWH6327XTSA1 P-channel MOSFET Transistor, 0.31 A, -20 V, 3-Pin SOT-323

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BSS223PWH6327XTSA1 - Infineon - PCB symbol
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PCB Footprints
BSS223PWH6327XTSA1 - Infineon PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT323-ren1
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3D Models
BSS223PWH6327XTSA1 - Infineon - 3D model - SOT23 (3-Pin) - SOT323-ren1
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BSS223PWH6327XTSA1 Details

  • Manufacturer Part Number:

    BSS223PWH6327XTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE, AVALANCHE RATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.39 A

  • Drain-source On Resistance-Max:

    1.2 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    22 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

BSS223PWH6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Infineon recommends following the recommended operating conditions, using a heat sink if necessary, and ensuring good thermal conductivity between the device and the heat sink. Additionally, consider using a thermal interface material to minimize thermal resistance.
  • The BSS223PWH6327XTSA1 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. A minimum of 2kV HBM and 100V MM protection is recommended.
  • Yes, the BSS223PWH6327XTSA1 is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, additional testing and validation may be required for specific applications.
  • Infineon recommends following the JEDEC J-STD-020 standard for soldering conditions. The recommended peak temperature is 260°C, with a maximum time above 217°C of 30 seconds.

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BSS223PWH6327XTSA1 Overview

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