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BSZ013NE2LS5IATMA1 - Infineon

Description: MOSFET LV POWER MOS

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BSZ013NE2LS5IATMA1 - Infineon - PCB symbol
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PCB Footprints
BSZ013NE2LS5IATMA1 - Infineon PCB footprint - Other - Other - PG-TSDSON-8 fused_3
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3D Models
BSZ013NE2LS5IATMA1 - Infineon - 3D model - Other - PG-TSDSON-8 fused_3
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BSZ013NE2LS5IATMA1 Details

  • Manufacturer Part Number:

    BSZ013NE2LS5IATMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    90 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    32 A

  • Drain-source On Resistance-Max:

    0.0017 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    160 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSZ013NE2LS5IATMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C. Implement proper thermal management, and consider using a heat sink or thermal interface material if necessary.
  • The BSZ013NE2LS5IATMA1 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the BSZ013NE2LS5IATMA1 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure that you follow the recommended operating conditions and guidelines for these applications.
  • Consult the Infineon application notes and troubleshooting guides for the BSZ013NE2LS5IATMA1. Perform a thorough analysis of the device's operating conditions, PCB layout, and surrounding circuitry to identify potential causes of the issue.

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BSZ013NE2LS5IATMA1 Overview

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