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BSZ018NE2LS - Infineon

Description: MOSFET N-Ch 25V 40A TDSON-8 OptiMOS

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BSZ018NE2LS - Infineon - PCB symbol
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PCB Footprints
BSZ018NE2LS - Infineon PCB footprint - Other - Other - BSZ018NE2LS-2
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3D Models
BSZ018NE2LS - Infineon - 3D model - Other - BSZ018NE2LS-2
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BSZ018NE2LS Details

  • Manufacturer Part Number:

    BSZ018NE2LS

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.75

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    ULTRA LOW RESISTANCE

  • Avalanche Energy Rating (Eas):

    150 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    23 A

  • Drain-source On Resistance-Max:

    0.0024 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    69 W

  • Pulsed Drain Current-Max (IDM):

    160 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSZ018NE2LS Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • The device requires a stable input voltage (VIN) and a proper biasing of the gate-source voltage (VGS) to ensure optimal performance. A voltage regulator and a voltage divider network can be used to achieve this.
  • Monitor the device's junction temperature (TJ), drain-source voltage (VDS), and drain current (ID) to prevent overheating. Ensure that the device is operated within the recommended operating conditions.
  • Use ESD protection devices such as TVS diodes or ESD arrays at the input and output pins. Ensure that the PCB is designed with ESD protection in mind, and handle the device with ESD-safe materials and tools.
  • Use a soldering temperature of 260°C (500°F) for a maximum of 10 seconds. Ensure that the device is not exposed to temperatures above 300°C (572°F) during the soldering process.

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BSZ018NE2LS Overview

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