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BSZ100N06LS3G - Infineon

Description: Trans MOSFET N-CH 60V 11A 8-Pin TSDSON T/R

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PCB Footprints
BSZ100N06LS3G - Infineon PCB footprint - Other - Other - BSZ100N06LS3G-2
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BSZ100N06LS3G - Infineon  - 3D model - Other - BSZ100N06LS3G-2
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BSZ100N06LS3G Details

  • Manufacturer Part Number:

    BSZ100N06LS3G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    55 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    20 A

  • Drain-source On Resistance-Max:

    0.0179 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    24 pF

  • JESD-30 Code:

    S-PDSO-N5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    50 W

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSZ100N06LS3G Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout for the BSZ100N06LS3G in their application note AN2013-03. It suggests using a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently.
  • To ensure proper biasing during startup, Infineon recommends using a soft-start circuit to slowly ramp up the gate voltage. This can be achieved using an RC network or a dedicated soft-start IC.
  • Although the datasheet specifies a maximum gate-source voltage of ±20V, it's recommended to limit the gate voltage to ±15V to ensure reliable operation and prevent damage to the device.
  • Yes, the BSZ100N06LS3G is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching losses, gate charge, and layout parasitics to ensure optimal performance.
  • The internal diode can be handled by using a snubber circuit or a dedicated diode in parallel with the device. This helps to reduce voltage spikes and ringing during switching transitions.

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BSZ100N06LS3G Overview

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