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BTS50080-1TEB - Infineon

Description: INFINEON - BTS50080-1TEB - POWER LOAD SW, HIGH SIDE, 30V, TO-252-5

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PCB Footprints
BTS50080-1TEB - Infineon PCB footprint - Other - Other - PG-TO252-5-11_2022
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BTS50080-1TEB Details

  • Manufacturer Part Number:

    BTS50080-1TEB

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-252

  • Package Description:

    TO-252, 5/4 PIN

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    Load switch

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-252

  • Package Equivalence Code:

    SMSIP4/5H,.39,44TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.5 mm

  • Supply Current-Max (Isup):

    2.2 mA

  • Supply Voltage-Max (Vsup):

    30 V

  • Supply Voltage-Min (Vsup):

    5.5 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    SIPMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.14 mm

  • Terminal Position:

    SINGLE

  • Threshold Voltage-Nom:

    +3.5V

  • Width:

    6.22 mm

BTS50080-1TEB Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BTS50080-1TEB is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -20°C to 125°C for optimal performance and reliability.
  • Proper cooling is crucial for the BTS50080-1TEB. Ensure good thermal contact between the device and a heat sink, and use a thermal interface material (TIM) to fill any gaps. The heat sink should be designed to dissipate heat efficiently, and the system should be designed to provide adequate airflow.
  • The recommended PCB layout for the BTS50080-1TEB involves using a multi-layer board with a solid ground plane, placing decoupling capacitors close to the device, and using wide traces for power and ground connections. Additionally, ensure that the PCB is designed to minimize electromagnetic interference (EMI) and electromagnetic compatibility (EMC) issues.
  • To protect the BTS50080-1TEB from overvoltage and overcurrent conditions, use a voltage regulator or a DC-DC converter to regulate the input voltage, and add overcurrent protection devices such as fuses or current-limiting resistors. Additionally, consider using a supervisory circuit to monitor the device's operating conditions and shut it down in case of an anomaly.
  • The recommended soldering and assembly techniques for the BTS50080-1TEB involve using a reflow soldering process with a peak temperature of 260°C, and ensuring that the device is handled and stored in a static-protected environment to prevent electrostatic discharge (ESD) damage.

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BTS50080-1TEB Overview

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