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BTT3050EJXUMA1 - Infineon

Description: Power Switch ICs - Power Distribution

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BTT3050EJXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-TDSO-8-31
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BTT3050EJXUMA1 Details

  • Manufacturer Part Number:

    BTT3050EJXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TDSO-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Additional Feature:

    CURRENT LIMIT:22A; THERMAL SHUTDOWN:200C

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSOP

  • Package Equivalence Code:

    TSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.15 mm

  • Supply Current-Max (Isup):

    0.25 mA

  • Supply Voltage-Max (Vsup):

    6.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

BTT3050EJXUMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermally conductive material for the PCB, and consider using a heat sink or thermal interface material. Also, follow the recommended operating conditions and derating guidelines.
  • A gate drive circuit with a low impedance output stage and a voltage swing of 10-15V is recommended. The gate drive circuit should also be able to provide a high current peak (e.g., 1-2A) to ensure fast switching.
  • Use a TVS diode or a zener diode to clamp the voltage, and consider adding a current sense resistor and a fuse or a current limiter to protect against overcurrent.
  • A dead time of 100-200ns is recommended to ensure proper switching and to prevent shoot-through currents. The exact dead time may vary depending on the specific application and switching frequency.

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