Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Infineon recommends following the thermal design guidelines, using a heat sink if necessary, and ensuring good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer between the device and heat sink.
Infineon recommends soldering at a peak temperature of 260°C for 10-30 seconds, with a soldering iron temperature of 350°C. Avoid using excessive soldering temperatures or times to prevent damage to the device.
Infineon recommends storing the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the devices by the body, not the leads, to prevent damage.
Infineon recommends following standard ESD protection procedures, such as using an ESD wrist strap or mat, and handling the devices in a static-protected environment. The device has an ESD rating of 2kV human body model and 150V machine model.
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BTT60302ERAXUMA1 Overview
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