BU-65863H8-E02 - DDC

BU-65863H8-E02 Details

• Manufacturer Part Number:

  BU-65863H8-E02

• Part Life Cycle Code:

  Active

• Part Package Code:

  BGA

• Package Description:

  BGA-312

• Pin Count:

  312

• Country Of Origin:

  Taiwan, USA

• HTS Code:

  8542.31.00.30

• Manufacturer:

  Data Device Corporation

• YTEOL:

  6.75

• Address Bus Width:

  32

• Boundary Scan:

  NO

• Bus Compatibility:

  PCI; USB

• Clock Frequency-Max:

  33.3 MHz

• Communication Protocol:

  MIL STD 1553B; MIL STD 1760

• Data Encoding/Decoding Method:

  BIPH-LEVEL (MANCHESTER)

• Data Transfer Rate-Max:

  1 MBps

• External Data Bus Width:

  32

• JESD-30 Code:

  R-PBGA-B312

• JESD-609 Code:

  e0

• Length:

  27.9 mm

• Low Power Mode:

  NO

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  32

• Number of Serial I/Os:

  4

• Number of Terminals:

  312

• On Chip Data RAM Width:

  17

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA312,13X24,40

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  260

• RAM (words):

  65536

• Screening Level:

  MIL-STD-883

• Seated Height-Max:

  4.7 mm

• Supply Voltage-Max:

  3.46 V

• Supply Voltage-Min:

  3.14 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  TIN LEAD

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  17.8 mm

• uPs/uCs/Peripheral ICs Type:

  SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553