ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (Ta = -40°C to 125°C) and consider derating the device's power dissipation according to the ambient temperature.
ROHM recommends using a ceramic capacitor with a value of 10uF to 22uF, and an X7R or X5R dielectric, placed as close as possible to the VIN pin to ensure stable operation.
To prevent EOS damage, follow proper ESD handling procedures, use an anti-static wrist strap, and ensure that the device is stored in an anti-static bag or container. Avoid touching the device's pins or exposing it to high-voltage sources.
ROHM recommends a soldering temperature of 260°C (max) and a soldering time of 10 seconds (max) to prevent damage to the device. A soldering iron with a temperature control is recommended.
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