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BU9253AS - ROHM Semiconductor

Description: IC KARAOKE ECHO SGL CHIP SDIP18

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PCB Footprints
BU9253AS - ROHM Semiconductor PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - SDIP18
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BU9253AS - ROHM Semiconductor  - 3D model - Dual-In-Line Packages - SDIP18
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BU9253AS Details

  • Manufacturer Part Number:

    BU9253AS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    ROHS COMPLIANT, SDIP-18

  • Pin Count:

    18

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    R-PDIP-T18

  • JESD-609 Code:

    e3/e2

  • Length:

    19.4 mm

  • Number of Functions:

    1

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -10 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SDIP

  • Package Equivalence Code:

    SDIP18,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.25 mm

  • Supply Current-Max:

    12 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN/TIN COPPER

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.778 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Width:

    7.62 mm

BU9253AS Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • To ensure stable operation with a high-ESR output capacitor, ROHM recommends adding a 1nF to 10nF ceramic capacitor in parallel with the output capacitor to reduce the overall ESR. Additionally, the output capacitor should be placed close to the BU9253AS to minimize parasitic inductance.
  • The maximum allowed voltage on the EN pin is 6V, which is higher than the recommended operating voltage of 5V. However, it's essential to ensure that the EN pin voltage does not exceed the supply voltage (VIN) to prevent damage to the device.
  • The BU9253AS is rated for operation up to 105°C, but ROHM recommends derating the output current and power dissipation to ensure reliable operation. A thermal design that keeps the junction temperature below 100°C is recommended for high-reliability applications.
  • The power dissipation of the BU9253AS can be calculated using the formula: Pd = (VIN x IIN) + (VOUT x IOUT) + (VIN x Iq), where IIN is the input current, IOUT is the output current, and Iq is the quiescent current. ROHM provides a power dissipation calculator on their website to simplify the calculation.

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BU9253AS Overview

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