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BUF602IDBVR - Texas Instruments

Description: High Speed Operational Amplifiers High Speed Closed Loop Buffer

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PCB Footprints
BUF602IDBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV (R-PDSO-G5)
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3D Models
BUF602IDBVR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV (R-PDSO-G5)
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BUF602IDBVR Details

  • Manufacturer Part Number:

    BUF602IDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    8.5 µA

  • Bandwidth (3dB)-Nom:

    1000 MHz

  • Bias Current-Max (IIB) @25C:

    7 µA

  • Input Offset Voltage-Max:

    30000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Min:

    0.048 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    5000 V/us

  • Slew Rate-Nom:

    8000 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    7.2 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000000

  • Width:

    1.6 mm

BUF602IDBVR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout with a solid ground plane, short traces, and decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a separate ground plane is also recommended. Additionally, it's essential to follow the datasheet's guidelines for pin placement and routing.
  • The output capacitor should be chosen based on the desired output impedance, stability, and noise performance. A minimum capacitance of 10uF is recommended, with a low ESR (Equivalent Series Resistance) and a high ripple current rating. X5R or X7R ceramic capacitors are suitable options. The datasheet provides a detailed guide for selecting the output capacitor.
  • The BUF602IDBVR can handle input voltages up to 12V, but it's recommended to operate within the specified input voltage range of 2.7V to 5.5V for optimal performance and reliability. Exceeding the maximum input voltage can lead to device damage or malfunction.
  • To ensure stability, follow the datasheet's guidelines for output capacitor selection, PCB layout, and decoupling. Additionally, ensure that the input voltage is within the specified range, and the device is operated within the recommended temperature range. It's also essential to avoid overloading the output and to use a suitable heatsink if necessary.
  • The typical power consumption of BUF602IDBVR depends on the input voltage, output current, and operating frequency. According to the datasheet, the quiescent current is typically around 1.5mA, and the total power consumption can range from 10mW to 100mW depending on the application. It's essential to consult the datasheet for detailed power consumption information.

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BUF602IDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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