Part Image

BUF602IDBVT - Texas Instruments

Description: 1000MHz,Wide Bandwidth, High-Speed, Closed Loop Buffer

Download BUF602IDBVT Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
BUF602IDBVT - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A_
click to zoom
3D Models
BUF602IDBVT - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A_
click to zoom

BUF602IDBVT Details

  • Manufacturer Part Number:

    BUF602IDBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    8.5 µA

  • Bandwidth (3dB)-Nom:

    1000 MHz

  • Bias Current-Max (IIB) @25C:

    7 µA

  • Input Offset Voltage-Max:

    30000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Min:

    0.048 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    5000 V/us

  • Slew Rate-Nom:

    8000 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    7.2 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000000

  • Width:

    1.6 mm

BUF602IDBVT Frequently Asked Questions (FAQs)

  • A good PCB layout for BUF602IDBVT involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a low-ESR capacitor for the output capacitor (Cout) to minimize ringing and oscillations.
  • The output capacitor (Cout) value depends on the desired closed-loop bandwidth, output impedance, and stability requirements. A general guideline is to choose a Cout value between 10nF to 100nF. A larger Cout value can improve stability but may reduce the bandwidth. It's recommended to consult the datasheet and application notes for more specific guidance.
  • The maximum power dissipation of BUF602IDBVT is dependent on the ambient temperature and the thermal resistance of the package. The maximum power dissipation can be calculated using the formula: Pd = (TJ - TA) / θJA, where TJ is the junction temperature, TA is the ambient temperature, and θJA is the thermal resistance. The datasheet provides more information on how to calculate the maximum power dissipation.
  • Yes, BUF602IDBVT can be used as a unity-gain buffer. However, it's essential to ensure that the input and output impedances are matched to prevent signal reflections and oscillations. Additionally, the output capacitor (Cout) value should be chosen carefully to maintain stability and minimize ringing.
  • To troubleshoot oscillations or instability issues with BUF602IDBVT, check the PCB layout for any noise or signal integrity issues, ensure that the input and output impedances are matched, and verify that the output capacitor (Cout) value is correct. Also, check for any voltage supply noise or ripple that may be affecting the device's stability.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

BUF602IDBVT Overview

Use the download button to access the BUF602IDBVT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BUF60, or try a keyword search, such as Buffer Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to BUF602IDBVT

Showing 0 results

BUF602IDBVT Alternates

Showing results

Image Part Number Model
Part Image BUF602IDBVR Texas Instruments

Buffer Amplifier, 1 Func, BIPolar, PDSO5

Part Image BUF602IDBVTG4 Texas Instruments

Buffer Amplifier, 1 Func, BIPolar, PDSO5