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BUF634AIDR - Texas Instruments

Description: 210-MHz, 250-mA high-speed buffer

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BUF634AIDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin SOIC-ren5
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BUF634AIDR - Texas Instruments  - 3D model - Small Outline Packages - 8-Pin SOIC-ren5
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BUF634AIDR Details

  • Manufacturer Part Number:

    BUF634AIDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2019-03-03

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    1.6 µA

  • Bandwidth (3dB)-Nom:

    210 MHz

  • Bias Current-Max (IIB) @25C:

    2 µA

  • Input Offset Voltage-Max:

    60000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    3750 V/us

  • Supply Current-Max:

    12 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    240000

  • Width:

    3.895 mm

BUF634AIDR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the BUF634AIDR is dependent on the thermal resistance of the package and the ambient temperature. According to the datasheet, the maximum power dissipation is approximately 2.5W at 25°C ambient temperature.
  • To ensure stability when using the BUF634AIDR as a voltage follower, it's recommended to add a capacitor (typically 10nF to 100nF) between the output and the inverting input to improve phase margin and reduce oscillations.
  • For optimal performance, it's recommended to follow good PCB design practices, such as keeping the input and output traces short and symmetrical, using a solid ground plane, and minimizing parasitic inductance and capacitance. Additionally, it's recommended to place the BUF634AIDR close to the power supply decoupling capacitors.
  • The BUF634AIDR has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures when handling the device. This includes using an ESD wrist strap or mat, and storing the device in an anti-static bag or container.
  • The recommended operating voltage range for the BUF634AIDR is 2.7V to 5.5V, although the device can operate down to 2.5V with reduced performance.

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BUF634AIDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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