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BUF634AIDRBR - Texas Instruments

Description: High Speed Operational Amplifiers 210-MHz, 250-mA high-speed buffer 8-SON -40 to 125

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BUF634AIDRBR - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - DRB0008B
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BUF634AIDRBR - Texas Instruments  - 3D model - Small Outline No-lead - DRB0008B
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BUF634AIDRBR Details

  • Manufacturer Part Number:

    BUF634AIDRBR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    2 µA

  • Bandwidth (3dB)-Nom:

    210 MHz

  • Bias Current-Max (IIB) @25C:

    2 µA

  • Input Offset Voltage-Max:

    60000 µV

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.11,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Slew Rate-Nom:

    3750 V/us

  • Supply Current-Max:

    12 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    240000

  • Width:

    3 mm

BUF634AIDRBR Frequently Asked Questions (FAQs)

  • A good PCB layout for BUF634AIDRBR involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a low-ESR capacitor for the output capacitor (Cout) to minimize ringing and oscillations.
  • The output capacitor (Cout) value depends on the desired output impedance, stability, and transient response. A general guideline is to use a Cout value between 10nF to 100nF. A larger Cout value can improve stability but may increase the settling time, while a smaller Cout value can improve transient response but may compromise stability.
  • The maximum power dissipation of BUF634AIDRBR is dependent on the ambient temperature and the thermal resistance of the package. The maximum power dissipation can be calculated using the formula: Pd = (TJ - TA) / θJA, where TJ is the junction temperature, TA is the ambient temperature, and θJA is the thermal resistance. The maximum power dissipation is typically around 1.4W at 25°C ambient temperature.
  • Yes, BUF634AIDRBR can be used as a unity-gain buffer. However, this may compromise the stability and noise performance of the device. When used as a unity-gain buffer, the BUF634AIDRBR may exhibit a higher noise figure and reduced bandwidth compared to its typical operation as a non-inverting amplifier.
  • To ensure stability, it's essential to follow the recommended PCB layout guidelines, use a suitable output capacitor (Cout) value, and ensure the device is properly decoupled. Additionally, the BUF634AIDRBR is sensitive to capacitive loads, so it's recommended to use a series resistor (Rs) to isolate the capacitive load and improve stability.

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BUF634AIDRBR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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