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BUF634F/500 - Texas Instruments

Description: High Speed Operational Amplifiers 250mA High-Speed Buffer

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PCB Footprints
BUF634F/500 - Texas Instruments PCB footprint - Other - Other - KTT(R-PSFM-G5)_2024
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3D Models
BUF634F/500 - Texas Instruments  - 3D model - Other - KTT(R-PSFM-G5)_2024
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BUF634F/500 Details

  • Manufacturer Part Number:

    BUF634F/500

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    D2PAK

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    20 µA

  • Bandwidth (3dB)-Nom:

    180 MHz

  • Bias Current-Max (IIB) @25C:

    20 µA

  • Input Offset Voltage-Max:

    100000 µV

  • JESD-30 Code:

    R-PSSO-G5

  • JESD-609 Code:

    e3

  • Length:

    10.16 mm

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-263

  • Package Equivalence Code:

    SMSIP5H,.6,67TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.13 mm

  • Slew Rate-Nom:

    2000 V/us

  • Supply Current-Max:

    20 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.7 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    180000

  • Width:

    8.925 mm

BUF634F/500 Frequently Asked Questions (FAQs)

  • A good PCB layout for BUF634F/500 involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a low-ESR capacitor for the output capacitor (Cout) to minimize ringing and oscillations.
  • The output capacitor (Cout) value depends on the desired output impedance, stability, and transient response. A general guideline is to use a Cout value between 10uF to 100uF, with a low ESR (Equivalent Series Resistance) to minimize ringing and oscillations. A higher Cout value can improve stability but may increase the settling time.
  • The maximum power dissipation of BUF634F/500 is dependent on the ambient temperature and the thermal resistance of the package. The maximum power dissipation can be calculated using the formula: Pd = (TJ - TA) / θJA, where TJ is the junction temperature, TA is the ambient temperature, and θJA is the thermal resistance. The maximum power dissipation is typically around 2.5W for the BUF634F/500.
  • To ensure stability, it's essential to follow the recommended PCB layout guidelines, use a low-ESR output capacitor, and ensure the input and output impedance are matched. Additionally, the BUF634F/500 has a built-in compensation network, but external compensation may be required for specific applications. It's recommended to simulate the circuit using SPICE models and perform stability analysis to ensure the circuit is stable.
  • The BUF634F/500 is a high-current, high-speed buffer amplifier with a unique combination of high output current (500mA) and high bandwidth (200MHz). It's designed for applications requiring high current drive and low distortion. Other buffer amplifiers from Texas Instruments may have different specifications, such as lower output current or bandwidth, making them more suitable for specific applications.

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BUF634F/500 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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