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BUL1203EFP - STMicroelectronics

Description: Bipolar (BJT) Transistor NPN 550 V 5 A 36 W Through Hole TO-220-3,1.5V @ 1A, 3A,9 @ 2A, 5V,36 W 150°C (TJ)

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BUL1203EFP - STMicroelectronics PCB footprint - Other - Other - TO-220FP_2025-3
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BUL1203EFP - STMicroelectronics  - 3D model - Other - TO-220FP_2025-3
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BUL1203EFP Details

  • Manufacturer Part Number:

    BUL1203EFP

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220FP, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    5 A

  • Collector-Emitter Voltage-Max:

    550 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    9

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    36 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BUL1203EFP Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the package can help to dissipate heat efficiently. It's also recommended to keep the thermal path as short as possible.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's current rating at high temperatures.
  • Use a common-mode choke and capacitors to filter out electromagnetic interference (EMI). Shielding the device and PCB can also help reduce EMI. Ensure that the PCB layout is designed to minimize radiation and susceptibility to EMI.
  • Use a voltage regulator or overvoltage protection (OVP) circuit to prevent voltage spikes. Implement overcurrent protection (OCP) using a current sense resistor and a comparator or a dedicated OCP IC.
  • Follow the recommended soldering temperature profile and use a solder with a melting point above 217°C. Ensure that the device is handled and stored in an ESD-safe environment.

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BUL1203EFP Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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