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BUP314 - Infineon

Description: IGBT,BUP314 52A 1200V TO218

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Symbol
BUP314 - Infineon - PCB symbol
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PCB Footprints
BUP314 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - PG-TO247-3-ren1
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3D Models
BUP314 - Infineon - 3D model - Transistor Outline, Vertical - PG-TO247-3-ren1
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BUP314 Details

  • Manufacturer Part Number:

    BUP314

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    HIGH SPEED

  • Collector Current-Max (IC):

    52 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    SINGLE

  • Fall Time-Max (tf):

    60 ns

  • Gate-Emitter Thr Voltage-Max:

    6.5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-218

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    300 W

  • Qualification Status:

    Not Qualified

  • Rise Time-Max (tr):

    100 ns

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    MOTOR CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    420 ns

  • Turn-on Time-Nom (ton):

    75 ns

BUP314 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a proper thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C.
  • Monitor the device's temperature, voltage, and current. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage and ensure reliable operation.
  • Optimize the switching frequency based on the application's requirements. A higher switching frequency can reduce losses, but may increase EMI. A lower switching frequency can reduce EMI, but may increase losses. Consult the datasheet and application notes for guidance.
  • Follow the recommended soldering temperature profile and handling procedures outlined in the datasheet and application notes. Avoid exposing the device to excessive mechanical stress, moisture, or electrostatic discharge.

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BUP314 Overview

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