Please enter a minimum 3 letters or numbers
Technical Content
Part Image

BUS1DJC3GWZ-E2 - ROHM Semiconductor

Description: ROHM - BUS1DJC3GWZ-E2 - Power Load Distribution Switch, High Side, Active High, 5V, 1 Output, 2A, 0.14ohm, UCSP-4

Download BUS1DJC3GWZ-E2 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
BUS1DJC3GWZ-E2 - ROHM Semiconductor - PCB symbol
click to zoom
PCB Footprints
BUS1DJC3GWZ-E2 - ROHM Semiconductor PCB footprint - BGA - BGA - UCSP30L1
click to zoom
3D Models
BUS1DJC3GWZ-E2 - ROHM Semiconductor - 3D model - BGA - UCSP30L1
click to zoom

BUS1DJC3GWZ-E2 Details

  • Manufacturer Part Number:

    BUS1DJC3GWZ-E2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    UCSP30L1-4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7.12

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    Load switch

  • JESD-30 Code:

    S-XBGA-B4

  • Length:

    0.8 mm

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR, EMBOSSED

  • Seated Height-Max:

    0.35 mm

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5 V

  • Supply Voltage-Min (Vsup):

    1.1 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    0.8 mm

BUS1DJC3GWZ-E2 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the IC to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material to improve heat transfer.
  • The BUS1DJC3GWZ-E2 has built-in ESD protection, but it is still recommended to follow standard ESD handling precautions during assembly and testing. A minimum of 2kV HBM and 100V MM protection is recommended.
  • Yes, the BUS1DJC3GWZ-E2 is AEC-Q100 qualified and suitable for use in high-reliability and automotive applications. However, additional testing and validation may be required depending on the specific application.
  • The recommended soldering conditions are 260°C peak temperature, 10-30 seconds dwell time, and a soldering iron temperature of 350°C maximum.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

BUS1DJC3GWZ-E2 Overview

Use the download button to access the BUS1DJC3GWZ-E2 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BUS1D, or try a keyword search, such as Power Management Circuits

Parts related to BUS1DJC3GWZ-E2

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑