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BV2HM050EFV-CE2 - ROHM Semiconductor

Description: Power Switch ICs - Power Distribution Automotive IPD Series 2ch High Side Switch: BV2HM050EFV-C is a 2ch high side switch for automotive application. It has a built in hiccup mode overcurrent protection function, thermal shutdown protection function, open load detection function, under v

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BV2HM050EFV-CE2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - HTSSOP-B20
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BV2HM050EFV-CE2 - ROHM Semiconductor  - 3D model - Small Outline Packages - HTSSOP-B20
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BV2HM050EFV-CE2 Details

  • Manufacturer Part Number:

    BV2HM050EFV-CE2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HTSSOP-20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    Load Switch

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    6.5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    10 mA

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Supply Voltage-Nom (Vsup):

    14 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3V

  • Width:

    4.4 mm

BV2HM050EFV-CE2 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a minimum of 10 thermal vias (0.3mm diameter) to ensure efficient heat dissipation. Additionally, a solid copper plane on the bottom layer can help to further reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow ROHM's recommended derating guidelines for the BV2HM050EFV-CE2. This includes reducing the maximum operating voltage and current as temperature increases. Additionally, consider using a heat sink or thermal interface material to improve heat dissipation.
  • ROHM recommends soldering the BV2HM050EFV-CE2 using a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. The component should be stored in a dry environment (less than 20% RH) and soldered within 168 hours of opening the package.
  • Yes, the BV2HM050EFV-CE2 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, it's essential to follow ROHM's recommended usage guidelines and ensure that the component is used within its specified operating conditions.
  • To prevent EOS and ESD damage, handle the BV2HM050EFV-CE2 with care, using anti-static wrist straps, mats, and packaging materials. Avoid touching the component's pins or exposed pads, and ensure that the PCB is properly grounded during assembly and testing.

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BV2HM050EFV-CE2 Overview

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