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BVSS123LT1G - onsemi

Description: AEC Qualified; PPAP Capable

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PCB Footprints
BVSS123LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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3D Models
BVSS123LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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BVSS123LT1G Details

  • Manufacturer Part Number:

    BVSS123LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    ROHS COMPLIANT, CASE 318-08, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    0.17 A

  • Drain-source On Resistance-Max:

    6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.225 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BVSS123LT1G Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a thermal relief pattern under the package. A minimum of 10 thermal vias under the package is recommended, with a via diameter of 0.3 mm and a pitch of 0.5 mm.
  • To ensure reliable operation across the full temperature range, it is essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, ensure that the device is properly soldered and that the PCB is designed to minimize thermal resistance.
  • The BVSS123LT1G has built-in ESD protection, but it is still important to follow proper ESD handling procedures during assembly and testing. It is recommended to use an ESD wrist strap or mat, and to handle the device by the body or leads to prevent damage.
  • Yes, the BVSS123LT1G is suitable for high-reliability and automotive applications. However, it is essential to follow the recommended operating conditions and to ensure that the device is properly qualified and validated for the specific application.
  • To prevent damage, it is recommended to store the device in its original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the device by the body or leads to prevent damage.

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BVSS123LT1G Overview

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