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BZT52B24-E3-08 - Vishay

Description: Zener Diode Single 24V 2% 80Ohm 500mW 2-Pin SOD-123 T/R

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Symbol
BZT52B24-E3-08 - Vishay - PCB symbol
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PCB Footprints
BZT52B24-E3-08 - Vishay PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123
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3D Models
BZT52B24-E3-08 - Vishay - 3D model - Small Outline Diode - SOD-123
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BZT52B24-E3-08 Details

  • Manufacturer Part Number:

    BZT52B24-E3-08

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    70 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    220 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Voltage-Nom:

    24 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    18 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Temp Coeff-Max:

    1 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

BZT52B24-E3-08 Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the BZT52B24-E3-08 can be found in the Vishay Intertechnologies' application note AN483, 'Surface Mounting Instructions for Diodes and Rectifiers'.
  • To prevent damage during soldering, it is recommended to follow the soldering profile recommended by Vishay Intertechnologies, which is a maximum temperature of 260°C for 10 seconds. Additionally, the component should be soldered within 8 days of unpacking from the moisture barrier bag.
  • Yes, the BZT52B24-E3-08 is compatible with lead-free soldering processes and meets the requirements of the RoHS directive.
  • The typical failure mode of the BZT52B24-E3-08 is a short circuit due to overheating or excessive current. This can be prevented by ensuring that the component is operated within its recommended specifications and that adequate heat sinking is provided.
  • Yes, the BZT52B24-E3-08 is suitable for use in high-reliability applications, such as aerospace, automotive, and medical devices, due to its high quality and reliability ratings.

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BZT52B24-E3-08 Overview

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