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BZT52C12S-TP - MCC

Description: Zener Diodes

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PCB Footprints
BZT52C12S-TP - MCC PCB footprint - Small Outline Diode - Small Outline Diode - SOD-323 (Thickness 1.15mm)
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3D Models
BZT52C12S-TP - MCC  - 3D model - Small Outline Diode - SOD-323 (Thickness 1.15mm)
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BZT52C12S-TP Details

  • Manufacturer Part Number:

    BZT52C12S-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    25 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    150 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    12 V

  • Reverse Current-Max:

    0.1 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5.39%

  • Working Test Current:

    5 mA

BZT52C12S-TP Frequently Asked Questions (FAQs)

  • The recommended storage temperature for BZT52C12S-TP is -40°C to 125°C.
  • Yes, BZT52C12S-TP is RoHS compliant, meaning it meets the European Union's Restriction of Hazardous Substances directive.
  • The maximum power dissipation for BZT52C12S-TP is 500 mW.
  • Yes, BZT52C12S-TP is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its high-quality manufacturing process and rigorous testing.
  • Yes, BZT52C12S-TP is available in tape and reel packaging, making it suitable for automated assembly and high-volume production.

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BZT52C12S-TP Overview

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Part Image BZT52C12S Jiangsu Changjiang Electronics Technology Co Ltd

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Part Image RD12SB-T1 Renesas Electronics Corporation

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For a full list of alternate parts for BZT52C12S-TP, check out Findchips.com