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BZT52C33S-TP - MCC

Description: Zener Diodes

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PCB Footprints
BZT52C33S-TP - MCC PCB footprint - Small Outline Diode - Small Outline Diode - SOD-323 (Thickness 1.15mm)
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3D Models
BZT52C33S-TP - MCC  - 3D model - Small Outline Diode - SOD-323 (Thickness 1.15mm)
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BZT52C33S-TP Details

  • Manufacturer Part Number:

    BZT52C33S-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    80 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    325 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    33 V

  • Reverse Current-Max:

    0.1 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    6.06%

  • Working Test Current:

    2 mA

BZT52C33S-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZT52C33S-TP can be found in the Micro Commercial Components' packaging information document or in the IPC-7351 standard. It is essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal and mechanical stress on the component.
  • To prevent damage, handle the BZT52C33S-TP by the body only, avoiding touching the glass diode or the leads. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the leads, and use a pick-and-place machine or a vacuum pickup tool to handle the component during assembly.
  • The maximum allowable voltage for the BZT52C33S-TP is 33V, as specified in the datasheet. Exceeding this voltage may cause permanent damage to the component or affect its reliability.
  • The BZT52C33S-TP is rated for operation up to 150°C. However, the component's reliability and lifespan may be affected by prolonged exposure to high temperatures. It is essential to evaluate the component's performance and reliability in the specific application and environment.
  • Store the BZT52C33S-TP in its original packaging or in a dry, cool place away from direct sunlight. Avoid exposing the component to moisture, humidity, or extreme temperatures. Follow the storage and handling guidelines provided by Micro Commercial Components to maintain the component's shelf life.

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BZT52C33S-TP Overview

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Part Image BZT52C33S Formosa Microsemi Co Ltd

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Part Image BZT52C33S Jiangsu Changjiang Electronics Technology Co Ltd

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Part Image BZT52C33S-T Micro Commercial Components

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Part Image BZT52C33S-13 Diodes Incorporated

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For a full list of alternate parts for BZT52C33S-TP, check out Findchips.com