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BZT52C8V2SHE3-TP - MCC

Description: • Halogen Free. "Green" Device (Note 1) • AEC-Q101 Qualified • Planar Die Construction • Ideally Suited for Automated Assembly Processes • General Purpose Medium Current • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating • Lead Free Finish/RoHS Compliant t ("P" Suffix Designates RoHS Compliant. See Ordering Information)

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BZT52C8V2SHE3-TP - MCC PCB footprint - Small Outline Diode - Small Outline Diode - SOD-323-4
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BZT52C8V2SHE3-TP - MCC  - 3D model - Small Outline Diode - SOD-323-4
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BZT52C8V2SHE3-TP Details

  • Manufacturer Part Number:

    BZT52C8V2SHE3-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-323, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    15 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    80 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    2

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Reference Voltage-Nom:

    8.2 V

  • Reverse Current-Max:

    0.7 µA

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Working Test Current:

    5 mA

BZT52C8V2SHE3-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for BZT52C8V2SHE3-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It is essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal and mechanical stress on the component.
  • BZT52C8V2SHE3-TP is a static-sensitive device. To handle it safely, use an anti-static wrist strap, mat, or workstation. Ensure that the workspace and tools are free from static electricity. Avoid touching the component's pins or body, and handle it by the package only.
  • The maximum storage temperature for BZT52C8V2SHE3-TP is 40°C (104°F) with a relative humidity of 90% or less. Storage beyond this temperature and humidity range may affect the component's reliability and performance.
  • BZT52C8V2SHE3-TP is a general-purpose Zener diode, and its frequency response is limited. For high-frequency applications, consider using a Zener diode specifically designed for high-frequency operation, such as those with a lower capacitance and inductance.
  • Use a soldering iron with a temperature of 250°C (482°F) or less. Apply a small amount of solder to the land pattern, and use a soldering technique that minimizes the thermal stress on the component. Avoid using excessive solder, as it can cause the component to lift off the board.

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BZT52C8V2SHE3-TP Overview

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