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BZW50-56 - STMicroelectronics

Description: 5000 W, 56 V TVS in DO-15

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PCB Footprints
BZW50-56 - STMicroelectronics PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - R6
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BZW50-56 - STMicroelectronics  - 3D model - Diodes, Axial Diameter Horizontal Mounting - R6
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BZW50-56 Details

  • Manufacturer Part Number:

    BZW50-56

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, R6, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    UL RECOGNIZED

  • Breakdown Voltage-Min:

    62.2 V

  • Case Connection:

    ISOLATED

  • Clamping Voltage-Max:

    129 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Peak Rev Power Dis-Max:

    5000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    6.5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5; MIL-STD-750

  • Rep Pk Reverse Voltage-Max:

    56 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    56 V

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

BZW50-56 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BZW50-56 is -55°C to 175°C.
  • To ensure reliability, follow the recommended storage and handling procedures, and ensure proper soldering and assembly techniques. Additionally, consider using a thermally conductive substrate and ensuring good thermal management.
  • A recommended PCB layout for the BZW50-56 includes a thermal pad connected to a large copper area, with multiple vias to dissipate heat. A thermal interface material (TIM) can also be used to improve thermal conductivity.
  • To calculate power dissipation, use the formula Pd = (Vz x Iz) + (Rth x Pd), where Vz is the zener voltage, Iz is the zener current, Rth is the thermal resistance, and Pd is the power dissipation.
  • The recommended soldering conditions for the BZW50-56 are a peak temperature of 260°C, with a soldering time of 10-15 seconds. A soldering iron with a temperature range of 200-250°C is recommended.

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BZW50-56 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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