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BZX384-B12,115 - NXP

Description: NXP - BZX384 series ZENER DIODE 12V, 300MW 40W, Working voltage range nominal 2.4 to 75 V, SOD323

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BZX384-B12,115 - NXP - PCB symbol
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PCB Footprints
BZX384-B12,115 - NXP PCB footprint - Other - Other - SOD323
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BZX384-B12,115 Details

  • Manufacturer Part Number:

    BZX384-B12,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    SOD

  • Package Description:

    PLASTIC, SMD, SC-76, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD323

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    NXP Semiconductors

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    150 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

BZX384-B12,115 Frequently Asked Questions (FAQs)

  • The recommended land pattern for BZX384-B12,115 can be found in the NXP application note AN11173, which provides guidelines for PCB layout and assembly of SOD323 packaged devices.
  • To prevent ESD damage, it is recommended to use an ESD wrist strap or mat when handling BZX384-B12,115 devices. Additionally, ensure that the PCB is designed with ESD protection in mind, such as using ESD protection diodes or resistors.
  • The maximum operating temperature range for BZX384-B12,115 is -65°C to +150°C, as specified in the datasheet. However, it's recommended to derate the voltage and current ratings according to the temperature derating curve provided in the datasheet.
  • Yes, BZX384-B12,115 is suitable for high-reliability applications. NXP Semiconductors provides a range of reliability data, including FIT rates and MTBF, which can be used to assess the device's suitability for high-reliability applications.
  • To select the correct voltage rating, determine the maximum voltage that will be applied to the device in your application. Then, choose a BZX384-B12,115 device with a voltage rating that is equal to or greater than the maximum voltage. It's also important to consider the voltage tolerance and derating factors.

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BZX384-B12,115 Overview

Use the download button to access the BZX384-B12,115 schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like BZX38, or try a keyword search, such as Zener Diodes

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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BZX384-B12,115 Alternates

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Part Image BZX384-B12,115 Nexperia

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