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BZX585-B10,115 - Nexperia

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BZX585-B10,115 - Nexperia  - 3D model
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BZX585-B10,115 Details

  • Manufacturer Part Number:

    BZX585-B10,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD523

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.95

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    10 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    150 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    10 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    7 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    8 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

BZX585-B10,115 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX585-B10,115 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask opening of 0.5 mm x 0.5 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conductivity between the component and the PCB by using a thermal via or a thermal pad. Also, consider using a thermal interface material (TIM) to improve heat transfer. The maximum operating temperature is 150°C, so ensure the component is not exposed to temperatures above this.
  • The recommended soldering profile for the BZX585-B10,115 is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • To ensure the BZX585-B10,115 is properly biased during operation, ensure the voltage across the component is within the recommended operating range of 10-15V. Also, ensure the component is connected in the correct polarity, with the anode connected to the positive voltage rail and the cathode connected to the negative voltage rail.
  • The BZX585-B10,115 has an internal ESD protection diode, but it is still recommended to take precautions during handling and assembly to prevent ESD damage. Use an ESD wrist strap or mat, and ensure the component is stored in an ESD-safe environment.

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BZX585-B10,115 Overview

Use the download button to access the BZX585-B10,115 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BZX58, or try a keyword search, such as Zener Diodes

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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