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BZX585-B10,135 - Nexperia

Description: Zener Diodes DIODE ZENER 2 PCT

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BZX585-B10,135 - Nexperia PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - Package outline SOD523 (SC-79-
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BZX585-B10,135 - Nexperia  - 3D model - Small Outline Diode Flat Lead - Package outline SOD523 (SC-79-
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BZX585-B10,135 Details

  • Manufacturer Part Number:

    BZX585-B10,135

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD523

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.95

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    10 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    150 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    10 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    7 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    8 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

BZX585-B10,135 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX585-B10,135 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.2 mm.
  • To handle thermal considerations, ensure a good thermal connection to a heat sink or a large copper area on the PCB. The thermal resistance of the device is 25°C/W, and the maximum junction temperature is 150°C.
  • The recommended soldering profile for the BZX585-B10,135 is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C. The device is compatible with lead-free soldering processes.
  • To ensure reliability, follow the recommended derating curves for voltage and current, and ensure that the device is operated within the specified temperature range. Additionally, consider using a thermal interface material to improve heat transfer.
  • The BZX585-B10,135 has an integrated ESD protection diode, but it is still recommended to follow proper ESD handling procedures during assembly and handling. The device can withstand ESD pulses up to 2 kV according to the human body model.

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BZX585-B10,135 Overview

Use the download button to access the BZX585-B10,135 schematic symbol, PCB footprint, and 3D model.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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