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C6713BZDPA200CIS - Texas Instruments

Description: Digital Signal Processors & Controllers - DSP, DSC C67x floating-point DSP- up to 300MHz, McBSP, 16-Bit EMIFA 272-BGA -40 to 105

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C6713BZDPA200CIS - Texas Instruments PCB footprint - BGA - BGA - ZDP (S–PBGA–N272)
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C6713BZDPA200CIS - Texas Instruments  - 3D model - BGA - ZDP (S–PBGA–N272)
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C6713BZDPA200CIS Details

  • Manufacturer Part Number:

    C6713BZDPA200CIS

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    272

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Address Bus Width:

    20

  • Barrel Shifter:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    200 MHz

  • External Data Bus Width:

    32

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B272

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    4

  • Number of Terminals:

    272

  • Number of Timers:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.57 mm

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

C6713BZDPA200CIS Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD (1.2V to 1.4V) first, followed by VIO (1.8V to 3.3V) and then the clock signal. This ensures proper initialization of the device.
  • Optimizing performance requires understanding the application's requirements and configuring the device accordingly. This includes selecting the appropriate clock frequency, cache settings, and memory allocation. TI provides tools like the Code Composer Studio (CCS) and the TMS320C6713 DSP Starter Kit to help with optimization.
  • The C6713BZDPA200CIS has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and airflow. TI recommends using a thermal interface material and a heat sink with a thermal resistance of less than 10°C/W.
  • To ensure EMC, follow proper PCB design and layout guidelines, use shielding and filtering, and minimize noise coupling. TI provides guidelines and recommendations in the datasheet and application notes.
  • For high-reliability or safety-critical applications, it's essential to follow TI's recommendations for fault tolerance, error detection, and correction. This includes using ECC memory, implementing watchdog timers, and following safety standards like IEC 61508.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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