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CAVC16T245QDGVRQ1 - Texas Instruments

Description: Automotive 16-Bit Dual-Supply Bus Transceiver With Configurable Voltage Translation

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CAVC16T245QDGVRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGV (R-PDSO-G48)
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CAVC16T245QDGVRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DGV (R-PDSO-G48)
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CAVC16T245QDGVRQ1 Details

  • Manufacturer Part Number:

    CAVC16T245QDGVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    COMMON CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    AVC

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    9.7 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS TRANSCEIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.06 mA

  • Prop. Delay@Nom-Sup:

    9.2 ns

  • Propagation Delay (tpd):

    9.6 ns

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    0.78 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

CAVC16T245QDGVRQ1 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow a star-topology layout, with the CAVC16T245QDGVRQ1 at the center. This minimizes signal skew and ensures signal integrity. Additionally, use a solid ground plane and decouple the power supply with 0.1uF and 10uF capacitors.
  • The CAVC16T245QDGVRQ1 has a junction-to-ambient thermal resistance of 24°C/W. To manage thermal performance, ensure good airflow, use a heat sink if necessary, and avoid blocking airflow around the device. Also, consider using thermal interface materials to reduce thermal resistance.
  • For the CAVC16T245QDGVRQ1, use 50Ω termination resistors on the outputs to ensure signal integrity and minimize reflections. You can also use Thevenin termination or AC termination depending on your specific application requirements.
  • To ensure signal integrity, use controlled impedance PCB traces, maintain a consistent signal return path, and minimize signal routing near noise sources. Also, use signal shielding and consider using differential signaling to reduce electromagnetic interference (EMI).
  • The CAVC16T245QDGVRQ1 requires a specific power sequencing to prevent latch-up and ensure proper operation. Power up VCC before VCCA, and ensure that VCCA is powered up within 100ms of VCC. Also, ensure that input signals are not applied until both VCC and VCCA are stable.

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CAVC16T245QDGVRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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