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CBTV24DD12ETY - NXP

Description: NXP - CBTV24DD12ETY - ANALOGUE MUX/DEMUX, 12CKT, 2:1, TFBGA

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Symbol
CBTV24DD12ETY - NXP - PCB symbol
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PCB Footprints
CBTV24DD12ETY - NXP PCB footprint - BGA - BGA - TFBGA48 (SOT1365-1)
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3D Models
CBTV24DD12ETY - NXP - 3D model - BGA - TFBGA48 (SOT1365-1)
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CBTV24DD12ETY Details

  • Manufacturer Part Number:

    CBTV24DD12ETY

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    3 X 8 MM,1 MM HEIGHT, 0.65 MM PITCH, GREEN, PLASTIC, SOT1365-1, TFBGA-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    SOT1365-1

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    R-PBGA-B48

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -10 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.05 mm

  • Supply Voltage-Max (Vsup):

    3.63 V

  • Supply Voltage-Min (Vsup):

    1.62 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Width:

    3 mm

CBTV24DD12ETY Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a 1.5 mm via diameter for optimal thermal performance.
  • Implement a thermal management system, such as a heat sink or fan, to maintain a junction temperature below 150°C. Also, ensure a stable power supply and minimize power dissipation.
  • Use 100 nF to 1 μF decoupling capacitors with a voltage rating of 10 V or higher. Place them as close as possible to the device's power pins, with a maximum distance of 5 mm.
  • Implement ESD protection using TVS diodes or ESD protection arrays at the input and output pins. Ensure a minimum of 2 kV HBM and 100 V MM protection.
  • Use a 50 Ω to 75 Ω termination scheme for the input and output pins, depending on the specific application requirements. Ensure proper impedance matching to minimize signal reflections.

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CBTV24DD12ETY Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like CBTV2, or try a keyword search, such as Other Consumer ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image CBTV24DD12ET NXP Semiconductors

Consumer Circuit, PBGA48