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CC1310F32RGZT - Texas Instruments

Description: TEXAS INSTRUMENTS - CC1310F32RGZT - MCU-Application Specific 32 bit, 48 MHz, 16 KB RAM/32 KB Program, 1.8 V to 3.8 V in, VQFN-48

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PCB Footprints
CC1310F32RGZT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGZ0048A
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CC1310F32RGZT - Texas Instruments  - 3D model - Quad Flat No-Lead - RGZ0048A
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CC1310F32RGZT Details

  • Manufacturer Part Number:

    CC1310F32RGZT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.50

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • CPU Family:

    CORTEX-M3

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    28672

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.8 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSOC

CC1310F32RGZT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout guide in the CC1310F32RGZT datasheet, but it's also recommended to follow the guidelines in the 'CC1310 SimpleLink™ Wireless MCU PCB Layout Guidelines' application note (SWRA477). This document provides detailed information on PCB layout, component placement, and routing to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To optimize power consumption, it's essential to understand the different power modes of the CC1310F32RGZT. The device has several power modes, including active, idle, and shutdown modes. By carefully managing these modes and using techniques such as dynamic voltage and frequency scaling, you can minimize power consumption. Additionally, using the Power Management API provided by TI can help optimize power consumption. Refer to the 'CC1310 Power Management' application note (SWRA479) for more information.
  • The CC1310F32RGZT has an operating temperature range of -40°C to 85°C. However, it's essential to note that the device's performance and reliability may be affected at extreme temperatures. For example, the device's RF performance may degrade at high temperatures, and the battery life may be affected at low temperatures. It's recommended to follow the guidelines in the datasheet and application notes for temperature-related considerations.
  • The CC1310F32RGZT is a wireless MCU that operates in the 2.4 GHz frequency band, which is subject to regulatory requirements in various regions. To ensure compliance, it's essential to follow the guidelines and regulations set by organizations such as the Federal Communications Commission (FCC) in the United States, the European Telecommunications Standards Institute (ETSI) in Europe, and the Ministry of Internal Affairs and Communications in Japan. TI provides guidance on regulatory compliance in the 'CC1310 Regulatory Compliance' application note (SWRA481).
  • The CC1310F32RGZT has an integrated antenna, but it's also possible to use an external antenna. For optimal performance, it's recommended to follow the guidelines in the 'CC1310 Antenna Design Guide' application note (SWRA483). This document provides information on antenna design, placement, and tuning to ensure optimal RF performance and range.

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CC1310F32RGZT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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