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CC1312R1F3RGZT - Texas Instruments

Description: Texas Instruments SimpeLink? Sub-1 GHz CC1312R Wireless MCU 48-VQFN -40 to 85

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CC1312R1F3RGZT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CC1312R1F3RGZT
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CC1312R1F3RGZT - Texas Instruments  - 3D model - Quad Flat No-Lead - CC1312R1F3RGZT
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CC1312R1F3RGZT Details

  • Manufacturer Part Number:

    CC1312R1F3RGZT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.50

  • Date Of Intro:

    2018-01-26

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    30

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    81920

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.8 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSoC

CC1312R1F3RGZT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout guide for the CC1312R1F3RGZT in the 'CC1312R1F3RGZT PCB Layout Guidelines' document. It's essential to follow this guide to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To optimize the CC1312R1F3RGZT's RF performance, ensure that the PCB layout follows the recommended guidelines, use a high-quality antenna, and optimize the transmission power and data rate according to your application's requirements. Additionally, consider using a shielded enclosure to minimize EMI.
  • The CC1312R1F3RGZT has an operating temperature range of -40°C to 85°C. However, it's essential to note that the device's performance may degrade at extreme temperatures, and the operating temperature range may vary depending on the specific application and use case.
  • Texas Instruments provides a Secure Boot and Firmware Update guide for the CC1312R1F3RGZT, which outlines the recommended procedures for implementing secure boot and firmware updates. It's essential to follow this guide to ensure the security and integrity of your device.
  • The CC1312R1F3RGZT has a typical current consumption of 5.5 mA in receive mode and 20 mA in transmit mode. However, the actual power consumption may vary depending on the specific application, data rate, and transmission power. It's essential to consult the datasheet and application notes for more detailed information.

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CC1312R1F3RGZT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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