Please enter a minimum 3 letters or numbers
Technical Content
Part Image

CC2564MODNCMOER - Texas Instruments

Description: Bluetooth Modules - 802.15.1 Bluetooth dual mode HCI module

Download CC2564MODNCMOER Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
CC2564MODNCMOER - Texas Instruments - PCB symbol
click to zoom
PCB Footprints
CC2564MODNCMOER - Texas Instruments PCB footprint - Other - Other - CC2564MODNCMOER-2
click to zoom
3D Models
CC2564MODNCMOER - Texas Instruments - 3D model - Other - CC2564MODNCMOER-2
click to zoom

CC2564MODNCMOER Details

  • Manufacturer Part Number:

    CC2564MODNCMOER

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    4

  • JESD-30 Code:

    S-XXMA-N33

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    33

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    XMA

  • Package Shape:

    SQUARE

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max:

    4.8 V

  • Supply Voltage-Min:

    2.2 V

  • Supply Voltage-Nom:

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    UNSPECIFIED

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSoC

CC2564MODNCMOER Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the CC2564MODNCMOER datasheet, which includes a 4-layer PCB stack-up with a dedicated ground plane and specific component placement guidelines to minimize noise and ensure optimal performance.
  • The CC2564MODNCMOER is a Bluetooth 5.0 module that supports BLE. To configure it for BLE applications, you need to use the TI Bluetooth SDK, which provides a set of APIs and example code to enable BLE functionality. You'll also need to ensure that your device is properly paired and connected to the module.
  • The CC2564MODNCMOER has a maximum transmission power of +10 dBm (10 mW) for Bluetooth 5.0 and +8 dBm (6.3 mW) for BLE. However, the actual transmission power can be adjusted using the TI Bluetooth SDK to optimize power consumption and range.
  • The CC2564MODNCMOER supports antenna diversity, which can improve the module's performance and range. To implement antenna diversity, you'll need to use two antennas, one for transmission and one for reception, and connect them to the module's antenna pins. You'll also need to configure the module's antenna diversity settings using the TI Bluetooth SDK.
  • The CC2564MODNCMOER has an operating temperature range of -40°C to +85°C, making it suitable for use in a wide range of applications, from consumer electronics to industrial automation.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

CC2564MODNCMOER Overview

Use the download button to access the CC2564MODNCMOER schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CC256, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to CC2564MODNCMOER

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑

CC2564MODNCMOER Alternates

Showing results

Image Part Number Model
Part Image XCC2564MODNCMOET Texas Instruments

Telecom Circuit, 1-Func