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CC2674P106T0RGZR - Texas Instruments

Description: RF Microcontrollers - MCU SimpleLink™ Arm® Cortex®-M33 multiprotocol 2.4-GHz wireless MCU with 1-MB flash and power amplifier 48-VQFN -40 to 105

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PCB Footprints
CC2674P106T0RGZR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGZ0048A
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3D Models
CC2674P106T0RGZR - Texas Instruments  - 3D model - Quad Flat No-Lead - RGZ0048A
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CC2674P106T0RGZR Details

  • Manufacturer Part Number:

    CC2674P106T0RGZR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.50

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.27SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.8 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSoC

CC2674P106T0RGZR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the CC2674P106T0RGZR datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using decoupling capacitors to ensure optimal performance.
  • To minimize power consumption, configure the device to use the lowest possible frequency, disable unnecessary peripherals, and use the power-down mode when not in use. Additionally, optimize the firmware to reduce CPU usage and use low-power modes whenever possible.
  • The CC2674P106T0RGZR has a maximum junction temperature of 150°C. Ensure proper thermal design, including heat sinks, thermal vias, and adequate airflow to prevent overheating. Follow the thermal design guidelines in the datasheet to ensure reliable operation.
  • Use the debugging tools provided by Texas Instruments, such as the SmartRF06EB or the XDS110, to debug and troubleshoot issues. Analyze the device's registers, memory, and peripherals to identify the root cause of the problem. Consult the datasheet, application notes, and online forums for guidance.
  • Follow the EMC guidelines in the datasheet and application notes to ensure compliance with regulatory requirements. Use shielding, filtering, and grounding techniques to minimize electromagnetic interference (EMI) and ensure reliable operation in noisy environments.

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CC2674P106T0RGZR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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