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CC2674R106T0RGZR - Texas Instruments

Description: RF Microcontrollers - MCU SimpleLink™ Arm® Cortex®-M33 multiprotocol 2.4-GHz wireless MCU with 1-MB flash 48-VQFN -40 to 105

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PCB Footprints
CC2674R106T0RGZR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - VQFN
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CC2674R106T0RGZR - Texas Instruments  - 3D model - Quad Flat No-Lead - VQFN
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CC2674R106T0RGZR Details

  • Manufacturer Part Number:

    CC2674R106T0RGZR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.50

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M33

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    32

  • Number of I/O Lines:

    42

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    48

  • Number of Timers:

    10

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.27SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    303104

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    48 MHz

  • Supply Current-Max:

    4.13 mA

  • Supply Voltage-Max:

    3.8 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

CC2674R106T0RGZR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the CC2674R106T0RGZR datasheet, but it's essential to follow good PCB design practices, such as keeping the power and ground planes separate, using a solid ground plane, and minimizing signal trace lengths. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for power and ground to reduce noise and EMI.
  • To ensure reliable communication, it's crucial to follow the recommended communication protocols and guidelines provided in the datasheet. Additionally, consider implementing error-checking mechanisms, such as CRC or checksum, to detect data corruption. It's also essential to ensure that the communication frequency and data rate are within the specified limits of the device.
  • The CC2674R106T0RGZR has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat dissipation mechanisms, such as a heat sink or thermal pad, to keep the device temperature within the specified limits. Additionally, consider the thermal resistance of the PCB and the ambient temperature of the operating environment.
  • To troubleshoot issues with the CC2674R106T0RGZR, start by reviewing the datasheet and application notes to ensure that the device is being used within its specified operating conditions. Use debugging tools, such as oscilloscopes or logic analyzers, to monitor the device's signals and identify potential issues. Additionally, consider using Texas Instruments' development tools and software, such as the CC2674R106T0RGZR Evaluation Module, to simplify the debugging process.
  • To minimize EMI and EMC issues, it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using shielding or filtering components. Additionally, consider using EMI-reducing components, such as ferrite beads or common-mode chokes, to reduce electromagnetic radiation. Ensure that the device is operated within its specified frequency range and that the system meets the relevant EMI and EMC standards.

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CC2674R106T0RGZR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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