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CC3351ENJARSBR - Texas Instruments

Description: Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz and 5GHz PA for complete wireless solution with up to +20.5dBm output power. • Operating temperature: –40°C to +105°C • Application throughput up to 50Mbps

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PCB Footprints
CC3351ENJARSBR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RSB0040B
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3D Models
CC3351ENJARSBR - Texas Instruments  - 3D model - Quad Flat No-Lead - RSB0040B
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CC3351ENJARSBR Details

  • Manufacturer Part Number:

    CC3351ENJARSBR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.2SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    1.98 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSoC

CC3351ENJARSBR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout guide in the CC3351EMUBGTR evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • To minimize power consumption, configure the device to use the lowest possible frequency, disable unnecessary peripherals, and use the power-saving modes (e.g., LPDS, Hibernate) when the device is not actively transmitting or receiving data. Refer to the CC3351 Power Management Guide for more information.
  • The maximum transmit power of the CC3351ENJARSBR is +20 dBm (100 mW) for IEEE 802.11b/g/n and +18 dBm (63 mW) for IEEE 802.11a/n/ac. However, the actual transmit power may vary depending on the specific application, antenna, and regulatory requirements.
  • Implement Wi-Fi coexistence by using the CC3351's built-in coexistence features, such as Dynamic Frequency Selection (DFS) and Transmit Power Control (TPC). Additionally, use the device's APIs to implement custom coexistence algorithms and prioritize traffic based on the specific wireless technology requirements.
  • Texas Instruments recommends using a monopole or dipole antenna design with a gain of 2-3 dBi for optimal Wi-Fi performance. The antenna should be placed at least 10 mm away from the PCB edge and oriented perpendicular to the PCB to minimize interference.

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CC3351ENJARSBR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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