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CIGB252012AG1R0MPE - SAMSUNG

Description: · Manufactured by state-of-the-art facilities which are entitled to the registration of ISO/IATF16949 · Meet AEC-Q200 requirements · Part Type Metal Composite Power Inductor · Package Type Thin Film Type · Shielding Magnetically Shielded Type · Operation Temp. Range –-55 to +150°C (Including self generated temperature rise) · Storage Temp. Range –-55 to +150°C (After assembly) · Termination General Type a d · ROHS-Free, Halogen-Free, Beryllium-Free

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CIGB252012AG1R0MPE - SAMSUNG - PCB symbol

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CIGB252012AG1R0MPE - SAMSUNG PCB footprint - Inductors Chip - Inductors Chip - CIGB252012AG1R0MPE

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CIGB252012AG1R0MPE - SAMSUNG - 3D model - Inductors Chip - CIGB252012AG1R0MPE

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Part Number CIGB252012AG1R0MPE
Manufacturer SAMSUNG
Pin Count 2
Part Category Inductor
Package Category Inductors Chip
Footprint Name Inductors Chip - CIGB252012AG1R0MPE
Released Date Nov 27, 2024
Last Modified Date Nov 27, 2024 9:39 AM UTC
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CIGB252012AG1R0MPE Details

Manufacturer Part Number:
CIGB252012AG1R0MPE
Manufacturer:
Samsung Electro-Mechanics

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