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CLVC16373AMDLREP - Texas Instruments

Description: Enhanced Product 16-Bit Transparent D-Type Latch With 3-State Outputs

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CLVC16373AMDLREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DL (R-PDSO-G48)
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CLVC16373AMDLREP - Texas Instruments  - 3D model - Small Outline Packages - DL (R-PDSO-G48)
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CLVC16373AMDLREP Details

  • Manufacturer Part Number:

    CLVC16373AMDLREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    ENABLE LOW/HIGH

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    15.875 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    16

  • Number of Ports:

    2

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    SSOP48,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.02 mA

  • Prop. Delay@Nom-Sup:

    4.2 ns

  • Propagation Delay (tpd):

    5.3 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.79 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.49 mm

CLVC16373AMDLREP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias under the device. Additionally, ensure that the power and ground pins are connected to a low-impedance source.
  • The CLVC16373AMDLREP has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow around the device.
  • While the datasheet specifies a maximum clock frequency of 100 MHz, the actual operating frequency may be limited by the system's signal integrity, PCB layout, and noise tolerance. It's recommended to perform signal integrity analysis and simulation to determine the maximum operating frequency for your specific design.
  • To ensure signal integrity, use controlled impedance traces, minimize trace lengths, and avoid stubs. Use termination resistors as recommended in the datasheet, and consider using a signal integrity analysis tool to simulate and optimize your design.
  • The CLVC16373AMDLREP requires a specific power sequencing to ensure proper operation. The VCC pin should be powered up before the VDD pin, and the VDD pin should be powered down before the VCC pin. Refer to the datasheet for the recommended power sequencing diagram.

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CLVC16373AMDLREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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For a full list of alternate parts for CLVC16373AMDLREP, check out Findchips.com