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CLVCH16T245MDGGREP - Texas Instruments

Description: Enhanced Product 16-Bit Dual-Supply Bus Transc., Configurable Voltage Translation, 3-State Outputs

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CLVCH16T245MDGGREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAG
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CLVCH16T245MDGGREP Details

  • Manufacturer Part Number:

    CLVCH16T245MDGGREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    COMMON CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    12.5 mm

  • Load Capacitance (CL):

    15 pF

  • Logic IC Type:

    BUS TRANSCEIVER

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    16

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.03 mA

  • Prop. Delay@Nom-Sup:

    23.8 ns

  • Propagation Delay (tpd):

    6.4 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.08 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

CLVCH16T245MDGGREP Frequently Asked Questions (FAQs)

  • A good PCB layout for the CLVCH16T245MDGGREP involves keeping the signal traces short and away from power planes, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended PCB layout in the datasheet and application notes.
  • The CLVCH16T245MDGGREP requires a specific power sequencing to prevent latch-up and ensure proper operation. TI recommends powering VCC before VCCA, and ensuring that VCCA is powered up within 100 ms of VCC. A power sequencing diagram is provided in the datasheet.
  • The maximum operating frequency of the CLVCH16T245MDGGREP is 245 MHz, but it can be limited by the system's signal integrity, PCB layout, and termination. TI recommends using IBIS models and signal integrity analysis tools to ensure signal integrity at high frequencies.
  • The CLVCH16T245MDGGREP outputs require proper termination to prevent signal reflections and ensure signal integrity. TI recommends using a 50-ohm termination resistor in series with a 50-ohm load, and placing the termination close to the device.
  • The maximum power consumption of the CLVCH16T245MDGGREP is 1.5 W, but it can be affected by the operating frequency, output load, and input voltage. TI recommends using the power consumption calculation formula provided in the datasheet to estimate the power consumption in a specific application.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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