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CMX910Q1 - CML Micro

Description: • Half-Duplex GM(F)SK, FSK and DSC Capabilities • I and Q Radio Interface • Slot/Sample Counter with UTC Timing Interface • Low-Power (3.0 to 3.6V) Operation • Optimum Co-channel and Adjacent-channel Performance • Low Profile, 64-lead LQFP (L9) and Leadless VQFN (Q1) Packages • Flexible Signal Channels – Two Simultaneous Rx – One Tx – Optional FSK Interface • Auxiliary ADC and DAC Functions – 5 x (10-bit) DACs – 5-Input MUX (10-bit) ADC • AIS Data Formatted and Raw Data Modes Applications: • S

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PCB Footprints
CMX910Q1 - CML Micro PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - Q1
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3D Models
CMX910Q1 - CML Micro  - 3D model - Quad Flat No-Lead - Q1
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CMX910Q1 Details

  • Manufacturer Part Number:

    CMX910Q1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    VQFN-64

  • Pin Count:

    64

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    CML Microcircuits Plc

  • JESD-30 Code:

    S-XQCC-N64

  • JESD-609 Code:

    e3

  • Length:

    9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    9 mm

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CMX910Q1 Overview

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