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CPF0402B178RE1 - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Width .02 INCH | Product Height .012 INCH | Product Width .5 MM | Product Length .039 INCH | Product Length 1 MM | Product Height .3 MM | Electrical Characteristics: Passive Component Tolerance .1 PCT | Power Rating .063 WATT | Operating Voltage 25 V | Resistance Class Up to 1kΩ | Resistance Value 178 OHM | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Package Size Code 0402 | Element Type Thin Film | Resisto

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CPF0402B178RE1 - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CPF0402
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CPF0402B178RE1 - TE Connectivity  - 3D model - Resistor Chip - CPF0402
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CPF0402B178RE1 Details

  • Manufacturer Part Number:

    CPF0402B178RE1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    15

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR

  • Physical Dimension:

    1mm x .5mm x .3mm

  • Rated Power Dissipation (P):

    0.063 W

  • Rated Temperature:

    70 °C

  • Resistance:

    178 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    25 V

CPF0402B178RE1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for CPF0402B178RE1 is a rectangular pad with a size of 0.5mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Yes, CPF0402B178RE1 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the operating conditions do not exceed the maximum ratings specified in the datasheet.
  • Yes, CPF0402B178RE1 is compatible with lead-free soldering processes. The component is designed to meet the requirements of RoHS and WEEE directives, and it can be soldered using lead-free solder alloys such as SAC305 or Sn96.5Ag3Cu0.5.
  • The typical tolerance for the resistance value of CPF0402B178RE1 is ±1%. This means that the actual resistance value may vary by up to 1% from the nominal value specified in the datasheet.
  • Yes, CPF0402B178RE1 is suitable for high-frequency applications up to 1 GHz. The component has a low inductance and a high self-resonant frequency, making it suitable for use in high-frequency circuits such as RF filters, antennas, and impedance matching networks.

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CPF0402B178RE1 Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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For a full list of alternate parts for CPF0402B178RE1, check out Findchips.com