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CPF0402B1K43E - TE Connectivity

Description: Thin Film Resistors - SMD CPF 0402 1%K43 0.1% 25PPM 5K RL

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CPF0402B1K43E - TE Connectivity - PCB symbol
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PCB Footprints
CPF0402B1K43E - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CPF0402
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CPF0402B1K43E - TE Connectivity - 3D model - Resistor Chip - CPF0402
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CPF0402B1K43E Details

  • Manufacturer Part Number:

    CPF0402B1K43E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    15

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR

  • Physical Dimension:

    1mm x .5mm x .3mm

  • Rated Power Dissipation (P):

    0.063 W

  • Rated Temperature:

    70 °C

  • Resistance:

    1430 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    25 V

CPF0402B1K43E Frequently Asked Questions (FAQs)

  • The recommended land pattern for CPF0402B1K43E is a rectangular pad with a size of 0.5mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.1mm from the component body.
  • CPF0402B1K43E is rated for operation up to 150°C, but it's recommended to derate the component's power rating at higher temperatures. Consult the datasheet for specific derating information and ensure that the component is suitable for your application's temperature requirements.
  • Handle CPF0402B1K43E by the edges or the body, avoiding touching the terminations or the component's electrical contacts. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
  • The recommended soldering process for CPF0402B1K43E is a reflow soldering process with a peak temperature of 260°C ± 5°C, and a dwell time of 20-30 seconds above 220°C. Ensure that the soldering process is compatible with the component's materials and the PCB's finish.
  • CPF0402B1K43E is not designed for use in humid or wet environments. It's recommended to use a conformal coating or potting compound to protect the component from moisture and ensure reliable operation in harsh environments.

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CPF0402B1K43E Overview

Use the download button to access the CPF0402B1K43E schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CPF04, or try a keyword search, such as Fixed Resistors

About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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