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CPF0805B59KE1 - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Width .049 INCH | Product Length .079 INCH | Product Width 1.25 MM | Product Height .022 INCH | Product Height .55 MM | Product Length 2 MM | Electrical Characteristics: Passive Component Tolerance .1 PCT | Power Rating .1 WATT | Resistance Value 59K OHM | Resistance Class 1kΩ – 1MΩ | Operating Voltage 100 V | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Resistor Type Precision Resistor | Package Size Cod

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CPF0805B59KE1 - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CPF0805
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CPF0805B59KE1 - TE Connectivity  - 3D model - Resistor Chip - CPF0805
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CPF0805B59KE1 Details

  • Manufacturer Part Number:

    CPF0805B59KE1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    14

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR

  • Physical Dimension:

    2mm x 1.25mm x .5mm

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    59000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    100 V

CPF0805B59KE1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for CPF0805B59KE1 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.2mm from the component body.
  • CPF0805B59KE1 is rated for operation up to 150°C, but it's recommended to derate the component's power rating at higher temperatures. Consult the datasheet for specific derating information and ensure that the component is suitable for your application's temperature requirements.
  • Handle CPF0805B59KE1 by the body only, avoiding touching the leads or the ceramic capacitor element. Use anti-static precautions, such as wrist straps or mats, to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the leads during assembly, and ensure that the component is properly seated on the PCB.
  • CPF0805B59KE1 is designed to meet the requirements of IEC 60068-2-6 for vibration and IEC 60068-2-27 for shock. However, it's recommended to perform additional testing and validation to ensure that the component meets the specific requirements of your application.
  • The recommended soldering process for CPF0805B59KE1 is a reflow soldering process with a peak temperature of 260°C ± 5°C, and a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is compatible with the component's materials and ratings.

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CPF0805B59KE1 Overview

Use the download button to access the CPF0805B59KE1 schematic symbol, PCB footprint, and 3D model.
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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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