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CPH3140-TL-E - onsemi

Description: Adoption of FBIT, MBIT processes; High breakdown voltage and large current capacity; High-speed switching; Ultrasmall size making it easy to provide high-density, small-sized hybrid ICs

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PCB Footprints
CPH3140-TL-E - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - CP_SOT-23zz
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3D Models
CPH3140-TL-E - onsemi  - 3D model - SOT23 (3-Pin) - CP_SOT-23zz
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CPH3140-TL-E Details

  • Manufacturer Part Number:

    CPH3140-TL-E

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CPH3

  • Pin Count:

    3

  • Manufacturer Package Code:

    318BA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Time@Peak Reflow Temperature-Max (s):

    30

CPH3140-TL-E Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Use a reflow soldering process with a peak temperature of 240°C to 250°C, and a dwell time of 30-60 seconds. Avoid wave soldering or hand soldering.
  • Yes, but ensure the device is operated within the recommended voltage range (up to 40V) and follow proper PCB layout and clearance guidelines to prevent electrical overstress.
  • Use a systematic approach: check power supply, input/output connections, and PCB layout. Verify proper thermal management and ensure the device is operated within recommended specifications.

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CPH3140-TL-E Overview

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