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CPH3462-TL-W - onsemi

Description: ON SEMICONDUCTOR - CPH3462-TL-W - MOSFET, N-CH, 100V, 1A, CPH-3

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PCB Footprints
CPH3462-TL-W - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - CPH3462-TL-W
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3D Models
CPH3462-TL-W - onsemi  - 3D model - SOT23 (3-Pin) - CPH3462-TL-W
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CPH3462-TL-W Details

  • Manufacturer Part Number:

    CPH3462-TL-W

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HALOGEN AND LEAD FREE, 318BA, CPH3, SC-59, 3 PIN

  • Manufacturer Package Code:

    318BA

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    1 A

  • Drain-source On Resistance-Max:

    0.785 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

CPH3462-TL-W Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Avoid wave soldering and hand soldering.
  • Handle the device in an ESD-controlled environment, use ESD-protective packaging, and ensure all equipment and personnel are grounded.
  • Use a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 4.7 μF to 10 μF, depending on the specific application requirements.

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CPH3462-TL-W Overview

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