Part Image

CPH5506-TL-E - onsemi

Description: Composite type with a PNP transistor and an NPN transistor contained in one package, facilitating high-density mounting; The CPH5506 consists of two chips encapsulated in a package which are equivalent to the CPH3115 and the CPH3215, respectively; Ultrasmall package facilitate miniaturization in end products. (0.9mm mounting height)

Download CPH5506-TL-E Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
CPH5506-TL-E - onsemi PCB footprint - Other - Other - CPH5506-TL-E-5
click to zoom
3D Models
CPH5506-TL-E - onsemi  - 3D model - Other - CPH5506-TL-E-5
click to zoom

CPH5506-TL-E Details

  • Manufacturer Part Number:

    CPH5506-TL-E

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CPH5

  • Pin Count:

    5

  • Manufacturer Package Code:

    318BC

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    53 Weeks, 3 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Case Connection:

    EMITTER

  • Collector Current-Max (IC):

    1.5 A

  • Collector-Emitter Voltage-Max:

    30 V

  • Configuration:

    COMMON EMITTER, 2 ELEMENTS

  • DC Current Gain-Min (hFE):

    200

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    5

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    500 MHz

CPH5506-TL-E Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Use a reflow soldering process with a peak temperature of 240°C to 250°C, and a dwell time of 20-30 seconds. Avoid wave soldering or hand soldering.
  • Implement ESD protection devices, such as TVS diodes or ESD arrays, on the input and output lines. Ensure a safe handling procedure during assembly and storage.
  • Use a low-ESR ceramic capacitor with a value of 10-22 μF, and a voltage rating of 25-50 V. Place the capacitor as close as possible to the device's input pins.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

CPH5506-TL-E Overview

Use the download button to access the CPH5506-TL-E schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CPH55, or try a keyword search, such as Small Signal Bipolar Transistors

Parts related to CPH5506-TL-E

Showing 0 results