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CS3361YDR14G - onsemi

Description: 80V Load Dump; Drives Logic Level Power NFET; Temperature Compensated Regulation Voltage; Shorted Field Protection Duty Cycle, Self Clearing; STATOR Power Up

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CS3361YDR14G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC - 14 NB
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CS3361YDR14G - onsemi  - 3D model - Small Outline Packages - SOIC - 14 NB
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CS3361YDR14G Details

  • Manufacturer Part Number:

    CS3361YDR14G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-14 NB

  • Pin Count:

    14

  • Manufacturer Package Code:

    751A-03

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    10 mA

  • Supply Voltage-Max (Vsup):

    17 V

  • Supply Voltage-Min (Vsup):

    9 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

CS3361YDR14G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, ensure proper PCB layout, and follow the recommended operating conditions. Also, consider using a thermistor or thermocouple to monitor the device temperature.
  • Monitor the device temperature, input/output voltage, and current. Implement over-temperature, over-voltage, and over-current protection mechanisms to ensure reliable operation.
  • Yes, but ensure you follow the recommended design and manufacturing guidelines. Additionally, consult with onsemi's application engineers and perform thorough testing and validation to ensure the device meets your specific requirements.
  • Implement power-saving modes, optimize the switching frequency, and ensure efficient thermal management. Also, consider using a low-dropout regulator (LDO) or a switching regulator with high efficiency.

Trust Checks

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Manufacturer Collaborated
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CS3361YDR14G Overview

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