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CSD25211W1015 - Texas Instruments

Description: -20V, P ch NexFET MOSFET™, single WLP 1.0x1.5, 33mOhm

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CSD25211W1015 - Texas Instruments - PCB symbol
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CSD25211W1015 - Texas Instruments PCB footprint - BGA - BGA - 6-BGA
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CSD25211W1015 - Texas Instruments - 3D model - BGA - 6-BGA
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CSD25211W1015 Details

  • Manufacturer Part Number:

    CSD25211W1015

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    -3.2 A

  • Drain-source On Resistance-Max:

    0.044 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    13.1 pF

  • JESD-30 Code:

    R-XBGA-B6

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

CSD25211W1015 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-frequency signals away from the power planes and use a common mode choke to filter the power supply.
  • Monitor the junction temperature (TJ) and ensure it stays within the recommended range (-40°C to 150°C). Also, ensure the input voltage (VIN) is within the recommended range (1.65V to 3.6V) and the output voltage (VOUT) is within the specified range (0.8V to 3.3V).
  • A 10uF to 22uF ceramic capacitor (X5R or X7R dielectric) is recommended for the input capacitor (CIN). This helps to filter the input voltage and reduce noise.
  • The output capacitor (COUT) value depends on the output voltage, output current, and desired ripple voltage. A general guideline is to use a 10uF to 47uF ceramic capacitor (X5R or X7R dielectric) for most applications. However, consult the datasheet and application notes for specific guidance.
  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device and avoid blocking the thermal pad. For high-power applications, consider using a heat sink with a thermal interface material.

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CSD25211W1015 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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